{
  "schema": "hsimc.reality-rd.public-product-state.v1",
  "artifact": "HRI-HSIMC-REALITY-RD-DTU-PRODUCT-004-C0-001",
  "publication_date": "2026-10-15",
  "route": "https://hsimc.tech/rd/dtu/",
  "product_number": "004",
  "product": "DTU · Physical Connectivity",
  "public_state": "PUBLIC_EVIDENCE_BOUNDED_HISTORY_C0_001",
  "authority": "NONE",
  "live_dtu_control_endpoint": false,
  "mcp_runtime_enabled": false,
  "physical_node_online": "NOT_ASSERTED",
  "history_range": "2026-05-29/2026-06-08",
  "historical_evidence": {
    "cloud_log_sha256": "06045b51b67db59e39d695c08d68e5d3744a4815d1a1d5540d66ac26ef4a51e1",
    "events": 42,
    "http_get": 36,
    "http_post": 6,
    "down_poll": 21,
    "acceptance": "HISTORICAL_CLOUD_EVENT_RECORD_ONLY",
    "sim_carrier_device_identity": "NOT_INDEPENDENTLY_ATTESTED",
    "eeg_uplink": "PROPOSED_NOT_VERIFIED"
  },
  "historical_price_note": "Approx CNY25 board with 30MB and CNY150 enclosure were 2026 research examples, not current offers.",
  "next_work": [
    "SERIAL_MODEM_CLOUD_EVIDENCE_BINDING",
    "NON_ACTUATING_REPLAY",
    "CONNECTIVITY_CAPABILITY_ADAPTER",
    "SINGLE_SENSOR_PRIVACY_AND_HUMAN_ACCEPTANCE",
    "GLOBAL_CONTRIBUTOR_WORK_AND_ECONOMIC_RIGHTS"
  ],
  "evidence_register": "https://hsimc.tech/rd/dtu/evidence.json",
  "sibling_routes": [
    "/rd/t736/",
    "/rd/ai-to-laser/",
    "/rd/nfc-writing/"
  ],
  "public_publishing_scope": "STATIC_RESEARCH_ONLY"
}